The Optimization of COF Inner Lead Bonding Using the Taguchi Method
碩士 === 雲林科技大學 === 工業工程與管理研究所碩士班 === 98 === Chip on film (COF), a low-cost, multi-functional, bendable, and carrying passive components, is a main element of LCD driver IC package. The quality of the COF inner lead bonding (ILB) affects the reliability of product. The car LCD monitor and in-car com...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/87112227124523100882 |