| Summary: | 碩士 === 雲林科技大學 === 工業工程與管理研究所碩士班 === 98 === Chip on film (COF), a low-cost, multi-functional, bendable, and carrying passive components, is a main element of LCD driver IC package. The quality of the COF inner lead bonding (ILB) affects the reliability of product. The car LCD monitor and in-car communication system have much commercial potential. The car IC has special size, wide and long, and has a shrinkage problem of polyimide (PI) during ILB. It causes not only bad looking on the surface of PI, but also low yield and quality after Potting.
This study is to find the optimal parameters of the COF inner lead bonding by using Taguchi method. Three factors are considered. They are tool head temperature, stage temperature, and bonding time; Signal-to-Noise ratio (S/N ratio) of PI coplanarity are calculated by using nominal-the-best (NTB) formula. The best combination of parameters are found by ANOVA.
The optimal parameters are: Factor A- Tool head temperature is 370℃, Factor B- Stage temperature is 130℃, Factor C- Bonding time is 0.5 seconds. The contribution of factors is: Factor A- 1.66%, Factor B- 40.86%, and Factor C- 7.40%. The original S/N ratio is 28.18db, and the optimal one is 35.51db, S/N ratio improves 7.33db. The original PI coplanarity is 16.88μm, and the optimal one is 19.58μm which is closer to the target limit (19+/-1μm). This study has a positive result that find the optimal parameters of process in shortest time, lowest cost, minimal experience times, most simple analysis, and limited resources by using Taguchi method.
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