Applications of Low Melting Point Active Solders as Thermal Interface Materials
碩士 === 雲林科技大學 === 機械工程系碩士班 === 98 === Thermal interface material (TIM) is a widely used as heat-radiating material in electronic packaging and electronic components. The main function of TIM is to fill the gaps and cavities between contact surfaces. Thus, it can improve the heat dissipation and redu...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/92291869327853020368 |