Mechanical Test Mechanics Analysis of Electronic Components in Thermal Cycling Test and Improvement of Its Alternative Mechanical Test

碩士 === 元智大學 === 機械工程學系 === 98 === Thermal cycling test, though time-consuming, is currently the most widely used reliability test for electronic components. However, a faster mechanical bend test is often adopted as an alternative for accelerated thermal cycle (ATC) test. But the stress states betw...

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Bibliographic Details
Main Authors: Tzu-Jung Huang, 黃子容
Other Authors: 陳永樹
Format: Others
Language:zh-TW
Published: 2010
Online Access:http://ndltd.ncl.edu.tw/handle/04777080254345829325