Mechanical Test Mechanics Analysis of Electronic Components in Thermal Cycling Test and Improvement of Its Alternative Mechanical Test
碩士 === 元智大學 === 機械工程學系 === 98 === Thermal cycling test, though time-consuming, is currently the most widely used reliability test for electronic components. However, a faster mechanical bend test is often adopted as an alternative for accelerated thermal cycle (ATC) test. But the stress states betw...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/04777080254345829325 |