Simulation of Substrate Crack Propagation in a Thin Film/Substrate System Subjected to Uniform Stress
碩士 === 元智大學 === 機械工程學系 === 98 === The extended finite element method (XFEM) is able to analyze the problems, for example, discontinuities and singularities that standard FEM cannot efficiently solve. XFEM allows modeling a crack without explicitly defining the crack surface and needs no remeshing wh...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/12420041091909391124 |