The Investigation of Eutectic Bonding Applied to COF-ILB Process and Its Thermal Performance Design
博士 === 國立中正大學 === 機械工程學系暨研究所 === 99 === The reliability of Chip-on-film (COF) packaging is fundamentally dependent upon the quality of the inner lead bonding (ILB) mechanism, such as eutectic bonding temperature, bonding force, and bonding duration. The aim of this research is to establish an optimi...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/88005247301318317609 |