Hygro-Thermo-Mechanical Analysis of Heterogeneous Adhesive Bonding Layer in Packaging Structures Using Infinite Element Method

博士 === 國立中正大學 === 機械工程學系暨研究所 === 99 === As a result of computer advancement in the last four decades, the finite element method (FEM) has been widely used in solving many engineering problems. The direct application of the conventional FEM to modeling of the particulate-reinforced and the fiber-rein...

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Bibliographic Details
Main Authors: Zhen-Wei Zhuang, 莊鎮瑋
Other Authors: De-Shin Liu
Format: Others
Language:zh-TW
Published: 2011
Online Access:http://ndltd.ncl.edu.tw/handle/15752101194728761887