Study on the Bonding Strength of Thermosonic Flip Chip Bonding on Flex Substrates after Reliability tests
碩士 === 國立中正大學 === 機械工程學系暨研究所 === 99 === The purpose of this study was to investigate the bonding strength of chip bonded onto flex substrate by thermosonic bonding after reliability test. A nickel layer was deposited to the flex substrate to improve the bondability. Reliability test including high t...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/65172363507815746639 |