Characterization and Reliability of nMOSFETs on Flexible Substrates under Mechanical Strain
碩士 === 長庚大學 === 電子工程學系 === 99 === With continued technology scaling, emerging three-dimensional (3D) integration technologies and System-in-Package (SiP) are the better solutions for miniaturization of systemized semiconductor devices than System-on-Chip(SoC). The 3D stacking is the predominant for...
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| Format: | Others |
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2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/55522608195516332664 |