| Summary: | 碩士 === 中原大學 === 電機工程研究所 === 99 === Abstract
The discussion topics of this report as below :
1. Growing and testing introduction of wafer: I will introduce concepts of growing, assembling,and testing in this chapter.
2. Introduction of testing tester and environment :Specifications, characteristic,and surface of wafer testing device will be introduced in this chapter.
3. Testing principle : Testing principle of test items that be programmed
for measuring wafer.
4. Testing recipe programming : Introduce programming process in this
chapter.
5. Testing result : Measurement value and waveform will be introduced in
this chapter.
In the present generation,most of instruments are controlled by IC.And what is the most important part inside IC? It is microchip.The microchip is cut from wafer.Wafer testing is the last defense that ensure the quality of every products.Cause this importance,I chosen “wafer testing” be my report topic.
The testing process of device RK28xx will be interpreted in report. First I introduced specifications and frameworks of tester.Then I explained measurement range that in my program of products.And I also interpret principles for every test items.Final,I explained what testing result mean,and how can I improve it.If I do something that could improve testing result,I will keep a record in this report.Testing result always be effected on factors such as temperature、miscellaneous signal、stability of tester…So,one tough question for testing is recipe programming(Because you need to study different program languages for different tester instrument),the other one is program debugging.What does program debugging mean?I think that find out the fail root cause,and solve the issue by experience and analysis self.The subject of testing can bring me satisfied accomplishments and learning.So I decide topic“Principle of probes and its measurement results for silicon wafers” be my graduate report.
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