The Probe and Scratch Theoretical Analysis of the Pad on High Temperature Wafer Test
碩士 === 國立高雄應用科技大學 === 模具工程系 === 99 === In industry application, to test the electrical nature of wafer during manufacture is very important. Probe will be contact the pad and produce the scratch in wafer testing process. Formerly literature demonstration, that the overdriver (OD), the probe geometry...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/37559330389488769989 |