| Summary: | 碩士 === 國立高雄應用科技大學 === 模具工程系 === 99 === In industry application, to test the electrical nature of wafer during manufacture is very important. Probe will be contact the pad and produce the scratch in wafer testing process. Formerly literature demonstration, that the overdriver (OD), the probe geometry and the temperature will influence the scratch size. This study use the finite element software ANSYS to analysis the scratch size on the pad. First of all, comparing the scratch sizes on pad of the experimental and the analysis data on the temperature is 25℃are in good agreement. Secondly, using the Taguchi method to analyze the scratch sizes on pad of the tungsten probe contact the pad on wafer, the testing conditions will change are: (a) the probe geometry sizes are the tip diameter, the bending angle and the beam length, respectively., (b) the temperatures are 75℃, 150℃ and 300℃, respectively., And, (c) the materials of the pad are aluminum, copper and iron, respectively. And, the noise factors (overdrive) are 10, 30, 50, 70 and 90μm, respectively. Lastly, we analysis the results of Taguchi method, and bring up the optimization probe geometry sizes under the noise factors.
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