Diffusion Barrier Effect of Nickel and Cobalt Layers between Bismuth Telluride and Copper and Their Influence on Thermoelectric Properties
碩士 === 國立中興大學 === 材料科學與工程學系所 === 99 === In this study, Ni、Co diffusion barriers and Cu film were deposited onto Bi2Te3 bulk by RF magnetron sputter. The cross section of sample are Cu/Ni/Bi2Te3/Ni/Cu and Cu/Co/Bi2Te3/Co/Cu, respectively. Then Annealed at 200°C for 1、2、3、4、16 hours and 1、4、8、16 hours...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/44569422096285933313 |