Study on High Power LEDs Thermal Dispersed Copper Cup Design of Light Extraction and High Power LEDs Array Modules Application
碩士 === 國立中興大學 === 精密工程學系所 === 99 === In this study, the effects of chip types and package materials of GaN light emitting diodes (LEDs) have been investigated on thermal resistance and heat dispersed. In this research, experiments and optical simulations are carried out to study the effect of bevele...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/16295020481306475084 |