Ultrasonic Power Effect on Interfacial Reactions and Phase Transformations of IMC for Copper Wire Bonding

碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 99

Bibliographic Details
Main Authors: Deng-JieHsu, 許登傑
Other Authors: Kuo-Chang Lu
Format: Others
Language:zh-TW
Published: 2011
Online Access:http://ndltd.ncl.edu.tw/handle/67587772499547814204