Development of a production management system of tape package for wafer level package image sensor
碩士 === 國立交通大學 === 工學院工程技術與管理學程 === 99 === The general chip manufacturer produces chips by a standard IC process flow with many level process steps. However, sometimes assembly house also provides more package services to fulfill different customer’s requests – They include a “Tape And Reel “package...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/49252948709914850219 |