Optimization of Parameter Design of Cu Wire Bonding Process in IC Assembly Industry
博士 === 國立交通大學 === 工業工程與管理學系 === 99 === The yield of IC (Integrated Circuit) assembly manufacturing is dependent on wire bonding. Recently, the semiconductor industry demands smaller IC designs and higher performance requirements. As such, bonding wires must be stronger, finer, and more solid. The co...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/73832824975569143868 |