Flip-Chip Packaging of MHEMT Device on Low Cost RO 3210 Organic Substrate for W-Band Applications
碩士 === 國立交通大學 === 材料科學與工程學系 === 99 === This study evaluates the feasibility of assembly mHEMT device using flip-chip technology on low cost Rogers RO3210 organic substrate for high speed and wireless communication applications up to W-band. The passive and active (In0.6GaAs0.4 mHEMT with 150 nm gate...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2010
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/90693915841279391855 |