Plasma-Enhanced Atomic Layer Deposited Thin Films as Diffusion Barriers on Porous Ultralow-k Dielectrics for Cu Interconnect Technology
博士 === 國立交通大學 === 材料科學與工程學系 === 99 === With the dimensional shrinkage of microelectronic devices, atomic layer deposition (ALD) becomes a very attractive method for the deposition of ultrathin films. Beacuse ALD can deposit uniform ultrathin thin films on substrates with high aspect ratio structure...
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| Format: | Others |
| Language: | en_US |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/36382520693494328737 |