Flip-Chip Interconnect for Millimeter-Wave Packaging Applications
博士 === 國立交通大學 === 材料科學與工程學系 === 99 === In recent years, with the demands for wireless communication systems increases rapidly, the operating frequency for the portable wireless is moving toward millimeter-waves. Millimeter-wave wireless communication systems require not only suitable functional IC c...
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| Format: | Others |
| Language: | en_US |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/51694934033658578352 |