Interfacial Reactions of Ti-Cu Foil Jointed Kovar Alloy-Alumina for Feehthrough Application
碩士 === 國立交通大學 === 材料科學與工程學系 === 99 === This work presents leak rate of different metal foils(Ti, Cu, Ni) to joint Kovar Alloy-Alumina. The sample (Al2O3/Ti/Cu/Kovar) has the better leak rate. The microstructure of the reaction interface in this sample were characterized using scanning electron micro...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/41351333393728540944 |