Microstructure Changes Associated with Interfacial Reactions, Electromigration and Thermomigration in Flip Chip Solder Joints
博士 === 國立交通大學 === 材料科學與工程學系 === 99 === It has been reported that the choice of proper under bump metallization (UBM) plays an important role in determining the reliability of solder joints. Ni, compared with Cu, possesses slower reaction rate with Sn-based solder joint and lower solubility therefore...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/47456101995729691328 |