Study of Low-k Dielectric Reliability of Cu Dual Damascene Interconnect
博士 === 國立交通大學 === 電子研究所 === 99 === This dissertation presents the modeling and characterization of low-k dielectric reliability of advanced Cu dual damascene interconnects. As the semiconductor integrated circuit continues shrink, the RC delay of interconnect has to decrease with the technology scal...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2011
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/36746950520209975701 |