Die-to-Die Multi-signaling Communication Mechanism with Common Conduction Layer
碩士 === 國立交通大學 === 電控工程研究所 === 99 === A broadcast interconnects method for 3D-IC applications is implemented by using common conduction layer. Die-to-Die Multi-signaling communication mechanism with common conduction layer has shorter communication distance. Compared with wireless or wire interconnec...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/19529948395220705631 |