Metallurgical Reactions of Sn-2.5Ag Solder with Various Thicknesses of Electroplated Cu/Ni Under Bump Metallization
碩士 === 國立交通大學 === 工學院碩士在職專班半導體材料與製程設備組 === 99 === Cu/Ni has been generally used as an under-bump metallization (UBM) layer in the bumping industry. The purpose of this thesis was investigated in the Sn/Ag interface metallurgy reaction of 97.5wt%Sn-2.5wt%Ag lead-free solder bump between different ele...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/66116398235387077658 |