Study of Electro-migration for Flip-Chip Solder bumps with 50um CuNi/SnAg
碩士 === 國立交通大學 === 工學院半導體材料與製程設備學程 === 99 === Flip-chip technology has become a mainstream trend in advanced electronic packaging because of its capability of higher I/O density and smaller package size. With higher current and smaller size trends, electromigration in flip-chip solder has become an c...
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| Format: | Others |
| Language: | zh-TW |
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2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/93699012805719883397 |