The Interfacial Reaction of SnAgIn Pb-Free Solder on Cu Substrates
碩士 === 國立中央大學 === 材料科學與工程研究所 === 99 === This thesis investigated the interfacial reaction between Sn-Ag-In lead-free solder and Cu substrates. Two composition of solder, 94Sn-3Ag-3In and 80Sn-3Ag-17In, were employed. the addition of indium decreases the melting point of 94Sn-3Ag-3In and 80Sn-3Ag-17I...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/53580872795950616260 |