Simultaneous Hotspot Temperature and Supply Noise Reduction using Thermal TSVs and Decoupling Capacitors
碩士 === 國立中央大學 === 電機工程研究所 === 99 === As the process technology progresses, the design flow of VLSI circuits becomes more and more complicated. Although the enhancing technique makes the chip size reduce, the fabrication cost arises simultaneously. The difference between two dimensional（2D）and three...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/30457466912067675961 |