The Modal Analysis and Test of a Semiconductor Wafer Vacuum Molding Machine
碩士 === 國立彰化師範大學 === 機電工程學系 === 99 === This paper combines finite element analysis (FEA) with experimental modal analysis (EMA), proceeding model verification of the Wafer Vacuum Molding Machine on vibration characteristics. In the theory, employ the SolidWorks and Pro/M to accomplish the modal analy...
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| Format: | Others |
| Language: | zh-TW |
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2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/03412641764901064798 |