RF Front-End Heterogeneous Chip Integration and the Use of Magnetically Coupled Interconnection Techniques
碩士 === 國立中山大學 === 電機工程學系研究所 === 99 === The first part of this thesis studies the wire-bonding technology for use in an integrated design of transformer balun and RF front-end receiver, which is realized by IPD and CMOS technology, respectively. In this part, the RF front-end receiver and the balun w...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/28207303028593133779 |