Study of Wide Band Electromagnetic Bandgap Structure for Ground Bounce Noise Suppression in Package-level
碩士 === 國立中山大學 === 通訊工程研究所 === 99 === With electronic devices trending toward higher clock rates, lower voltage levels, and smaller form factors, the simultaneously switching noise (SSN), which is induced in package and printed circuit board, is one of the major factors affecting the performance and...
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/90823759742734513380 |