Construction and Verification of an In-Plane/Out-of-Plane Integrated ESPI System
碩士 === 國立清華大學 === 動力機械工程學系 === 99 === As the progress of semiconductor manufacturing technology, even the mechanical components in MEMS (Micro Electro Mechanical System) are fairly small and shrink to micro-scale. Accompanied with the size reduction, how to measure the deformation of a package...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/37195207700337809439 |