On the Dressing Efficiency on Polishing Pad with Design of Brazed Organic Diamond Disk
碩士 === 國立清華大學 === 動力機械工程學系 === 99 === Chemical Mechanical Polishing is the most effective method in the process of wafer planarization. As the size of silicon wafer and line width is improved, the development of the technique of planarization has been a crucial issue. Because surface circumstances o...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/70420985361638920684 |