The Study of Through Silicon Via(TSV) Coupling Noise
碩士 === 國立清華大學 === 電子工程研究所 === 99 === In recent years, the improvement of the semiconductor technology have been focused on how to effectively use the costly chip area. To accommodate more transistors in a single chip, people try to minimize the size of the transistors for the past few decades. As th...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/23944229172713823421 |