可修補的三維晶片設計與修補方法
博士 === 國立清華大學 === 電機工程學系 === 99 === In view of the challenges encountered by CMOS scaling, it seems inevitable that a highly integrated system on chip (SOC) must start from low production yield, and then it takes tremendous time and effort to improve the yield to a reasonably high level. Three-dimen...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/10213278359772366387 |