Preparation and Properties of Cu Films with Dilute Insoluble Substances for Barrierless Metallization on GaAs
博士 === 國立臺灣海洋大學 === 材料工程研究所 === 99 === Barrierless copper metallization on GaAs was conducted and the film structure thus obtained characterized. Pure Cu films and Cu doped with Ta, Ru, and N were co-sputtered by R.F. magnetron sputter deposition on barrierless GaAs, followed by post-annealing for 1...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | en_US |
Published: |
2011
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Online Access: | http://ndltd.ncl.edu.tw/handle/62974340898266752596 |