Combined Effects of Cu Concentration, Solder Volume, and Temperature on SnAgCu/Ni Interfacial Reaction
博士 === 國立臺灣大學 === 材料科學與工程學研究所 === 99 === Soldering is the most important joining technology in the electronic industry and the Sn-Ag-Cu serious of lead-free solders, around the Sn(3.5Ag±0.3)Ag(0.9±0.2)Cu (wt.%) ternary eutectic composition, are the most promising alternates. With the miniaturization...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/29342151695007413109 |