Thermal-aware Test Scheduling and TAM Optimization for 3D IC
碩士 === 國立臺灣大學 === 電子工程學研究所 === 99 === Three-dimensional integrated circuits (3D ICs) have many advantages over traditional integrated circuits such as shorter global interconnect, higher performance, higher packing density, and so on. Although 3D ICs have such advantages, there are many difficultie...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/68918933537149898145 |