A Chip-Package-Board Codesign Methodology
碩士 === 國立臺灣大學 === 電機工程學研究所 === 99 === In today''s IC production, the design processes of chip, package, and board are separate from each other. However, the lack of information from other domains dramatically increases the design difficulty and reduces the quality of the product. E...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2011
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/48940177718280905195 |