Analysis on Interaction Force of Abrasive Grits in CMP by AFM
碩士 === 國立臺灣科技大學 === 機械工程系 === 99 === The chemical mechanical planarization / polishing (CMP) process is an important process fabrication of the semiconductor devices. It can achieve the flattening effects of wafer or film on wafer by the interaction within pad, abrasive grits and film on wafer. The...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/w364br |