A Numerical Study on Heat Transfer of LED Chip Packing Levels
碩士 === 國立臺灣科技大學 === 機械工程系 === 99 === This dissertation present a numerical study on heat transfer of validation natural convective air cooling of a high brightness 3x3, 4x5, 7x7 LED array package on a printed circuit board (PCB) during operation on difference conditions. Temperature distribution and...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/gahnp9 |