Investigation of the Wire Bonging Technique in the Light-Emitting-Diode Packaging
碩士 === 國立臺灣科技大學 === 醫學工程研究所 === 99 === Among all electrical packaging, wire bonding process is most popular method for electrical interconnection. During the boning process , parameters and bonding material, for example, capillary and chip, played critical roles. In this thesis, we investigated how...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/rh67d9 |