The Study of Improvement of Tombstone in Flip Chip Package with Taguchi Method
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 99 === This study is focused on solving the tombstone issue of surface mount technology in current flip chip assembly process. Taguchi methodology is used to get the optimal design and is verified by experiments. The result concludes that the thinner st...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/48322548871781544018 |