Three Dimensions Interconnect Investigationof System in Package
碩士 === 國立高雄大學 === 電機工程學系碩士班 === 99 === In this thesis, a set of analysis tools and techniques in initial stage of the design process is presented for co-design. To detach signal traces of BGA substrate in several segmented models by structure. We detach the BGA substrate to many segmented models by...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/8dwy8w |