A Study of Mold Flow Analysis in In-Mold Decoration Process for Thin Shell Surface
碩士 === 南台科技大學 === 機械工程系 === 99 === The purpose of this study is to utilize the multi-component molding (MCM) module of mold flow analysis software (Moldex3D) to solve in-mold decoration (IMD) forming problems, such as warpage and shear stress of a thin-shell electronic product. From the analysis of...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
100
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| Online Access: | http://ndltd.ncl.edu.tw/handle/67938103135619227998 |