The Influence of Adhesive Materials on Chip-On-Board Packing of MEMS Microphone
碩士 === 南台科技大學 === 機械工程系 === 99 === MEMS microphone die attached on the printed wiring board (PWB) is by the chip-on-board (COB) process, and then sealed with a conductive outer cover to prevent interference from outside factors such as electromagnetic. Furthermore, MEMS microphone chip bonding on th...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
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| Online Access: | http://ndltd.ncl.edu.tw/handle/50084779950533969387 |