The Simulation of Reflow Temperature Profile to Comply with The Process Specification
碩士 === 國立臺北科技大學 === 工業工程與管理研究所 === 99 === The temperature profiles on the critical locations of the board during reflow soldering are important to result in the desired solder joint quality. This research establishes a procedure to predict the temperature profile based on given information about the...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/k897sf |