The Simulation of Reflow Temperature Profile to Comply with The Process Specification

• Main Authors: Jian-Huang Tseng, 曾建煌
• Other Authors: 黃乾怡
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/k897sf

碩士 === 國立臺北科技大學 === 工業工程與管理研究所 === 99 === The temperature profiles on the critical locations of the board during reflow soldering are important to result in the desired solder joint quality. This research establishes a procedure to predict the temperature profile based on given information about the PCB designs and components loading. First, critical factors such as the conveyor speed and temperature settings of adjacent zones that may influence the heating process are identified and investigated. A regression model and artificial neural network are constructed to more accurately predict the temperature profile. Results of this study will help improve the efficiency of temperature setting process in the pilot run stage.