The Simulation of Reflow Temperature Profile to Comply with The Process Specification
碩士 === 國立臺北科技大學 === 工業工程與管理研究所 === 99 === The temperature profiles on the critical locations of the board during reflow soldering are important to result in the desired solder joint quality. This research establishes a procedure to predict the temperature profile based on given information about the...
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ndltd-TW-099TIT051170072019-05-15T20:42:26Z http://ndltd.ncl.edu.tw/handle/k897sf The Simulation of Reflow Temperature Profile to Comply with The Process Specification 迴焊溫度曲線模擬以符合製程規範 Jian-Huang Tseng 曾建煌 碩士 國立臺北科技大學 工業工程與管理研究所 99 The temperature profiles on the critical locations of the board during reflow soldering are important to result in the desired solder joint quality. This research establishes a procedure to predict the temperature profile based on given information about the PCB designs and components loading. First, critical factors such as the conveyor speed and temperature settings of adjacent zones that may influence the heating process are identified and investigated. A regression model and artificial neural network are constructed to more accurately predict the temperature profile. Results of this study will help improve the efficiency of temperature setting process in the pilot run stage. 黃乾怡 2011 學位論文 ; thesis 59 zh-TW |
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碩士 === 國立臺北科技大學 === 工業工程與管理研究所 === 99 === The temperature profiles on the critical locations of the board during reflow soldering are important to result in the desired solder joint quality. This research establishes a procedure to predict the temperature profile based on given information about the PCB designs and components loading. First, critical factors such as the conveyor speed and temperature settings of adjacent zones that may influence the heating process are identified and investigated. A regression model and artificial neural network are constructed to more accurately predict the temperature profile. Results of this study will help improve the efficiency of temperature setting process in the pilot run stage.
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author2 |
黃乾怡 |
author_facet |
黃乾怡 Jian-Huang Tseng 曾建煌 |
author |
Jian-Huang Tseng 曾建煌 |
spellingShingle |
Jian-Huang Tseng 曾建煌 The Simulation of Reflow Temperature Profile to Comply with The Process Specification |
author_sort |
Jian-Huang Tseng |
title |
The Simulation of Reflow Temperature Profile to Comply with The Process Specification |
title_short |
The Simulation of Reflow Temperature Profile to Comply with The Process Specification |
title_full |
The Simulation of Reflow Temperature Profile to Comply with The Process Specification |
title_fullStr |
The Simulation of Reflow Temperature Profile to Comply with The Process Specification |
title_full_unstemmed |
The Simulation of Reflow Temperature Profile to Comply with The Process Specification |
title_sort |
simulation of reflow temperature profile to comply with the process specification |
publishDate |
2011 |
url |
http://ndltd.ncl.edu.tw/handle/k897sf |
work_keys_str_mv |
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