Application of Taguchi Method of Wrpage Deformation in IC Packages
碩士 === 國立雲林科技大學 === 工業工程與管理研究所碩士班 === 99 === IC warpage, in process has been a major issue, particularly relevant to compound filling process.When the configurations of process parameters are improper, which may lead to the occurrence of failure mechanisms, such as short circuit. The purpose of the...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/71858562682009405909 |