Electromigration Reliability of Sn-Ag-Cu Solder Joints Containing Various Ag Contents
碩士 === 元智大學 === 化學工程與材料科學學系 === 99 === Electromigration phenomena in Cu/Sn/Cu、Cu/Sn-Ag-Cu/Cu solder joint were investigated in this study. In this study, we observed the Sn-Ag-Cu solder can reduce electromigration damages. The joints had a typical line-to-bump geometry with the Cu/Sn-Ag-Cu/Cu conf...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/75639826476992865070 |